July 3, 2017

Zuken now offers enhanced support for communication between multidisciplinary design teams through the new CADSTAR Redlining markup tool.

The latest version of its CADSTAR desktop PCB design software also supports industry requirements for high-speed design, and includes across-the-board performance enhancements and ease-of-use features. One highlight is developments in the industry-leading Activ-45 router – making the routing experience even more intuitive and powerful, and giving users more control over their designs.

 Redlining for speedy and accurate communication

The new CADSTAR Redlining tool improves...

June 27, 2017

In this June 29, 2017 webinar, attendees will get an overview of the functionality in the PADS Router environment and demonstrate how easy it is to route to the rules created for your design, including your high-speed constraints.

Attendees will learn:

-  Interactive routing and other PCB layout functions in the PADS Router

-  Defining high-speed contraints

-  Autorouting in the PADS Router with high-speed rules

-  Setting up routing Strategies for the PADS Router

Webinar presenter Ernie Frohring is a senior applications engineer with Trilogic Inc. He specializes in high-speed design, teaching classes, doing presentations, and working one-on-one with customers using the EDA tools from Mentor Graphics

Date and...

June 15, 2017

Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (Outsourced Assembly and Test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs. By launching this program, Mentor will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced Amkor Technology, Inc. as its first OSAT Alliance member.   

Through the Mentor OSAT Alliance, members work with Mentor to create certified design kits to...

June 5, 2017

Mentor, a Siemens business, today announced that it has launched the Mentor OSAT (Outsourced Assembly and Test) Alliance program to help drive ecosystem capabilities in support of new high-density advanced packaging (HDAP) technologies like 2.5D IC, 3D IC and fan-out wafer-level packaging (FOWLP) for customer integrated circuit (IC) designs. By launching this program, Mentor will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced Amkor Technology, Inc. as its first OSAT Alliance member.   

Through the Mentor OSAT Alliance, members work with Mentor to create certified design kits to...

June 1, 2017

ntercept Technology Inc., a leader in EDA engineering and layout applications, today announces the availability of a major new enhancement release of its Pantheon PCB layout software, which includes specialized RF and Hybrid design flows. Complementing this new Pantheon version is a major enhancement release of Intercept’s Mozaix CAE schematic design software. The Mozaix version 5.0 and Pantheon version 7.2 releases are paired together with unified user interfaces for increased productivity for existing users, and for shorter ramp up time for new users. Both new versions are fully compliant on Microsoft Windows 10 and Linux Redhat 6.

 ...

May 26, 2017

This article was published in the April 2017 issue of the PCB Design Magazine.

A few months before I joined Altium, while I was still with I-Connect007, I sat down with Lawrence Romine to discuss the company’s drive to satisfy the individual PCB designer, and not necessarily the OEMs who employ them. Romine also explains what sets designers and engineers apart from the average person, and why some Altium users have a different primary EDA tool, but use Altium when they need a design done fast.

Judy Warner: Lawrence, before we get started, why don't you tell us a little bit about your background.

Lawrence Romine: My background is about 16 years in professional business. My father was an engineer. Grew up working in the garage with...

May 22, 2017

This Mentor white paper, originally presented at DesignCon and nominated for a best paper award, includes an investigation of DDR4's Pseudo Open Drain driver and what its use means for power consumption and Vref levels for the receivers.

This paper also examines a DDR4 system design example and the need for simulating with IBIS power aware models versus transistor level models for Simultaneous Switching Noise characterization.

To download this paper, click here.

May 17, 2017

Altium Designer

ALTIUM DESIGNER® 17.1...
May 15, 2017

Nearly all companies listed on TrendForce’s revenue ranking of the global top 10 fabless IC design houses for the first quarter posted year-on-year growth. Novatek was the sole exception and saw a slight dip in its revenue compared with the same period a year ago. For IC companies, the growing sources of end-market demand for this year come from networking equipment, data centers, servers and automotive electronics.

Broadcom Limited, which is a major supplier of products related to network infrastructure and wireless communication, dethroned Qualcomm as the revenue leader for the first quarter of 2017. NVIDIA exhibited impressive growth recently and took third place by displacing MediaTek, which occupied that spot for quite a long period.

TrendForce analyst CY Yao pointed...

May 10, 2017

Mentor, a Siemens business, has launched the newest release of the FloTHERM® XT electronics cooling software product with advanced thermal management capabilities. Based on the electronics cooling DNA of the Mentor market-leading FloTHERM technology and the FloEFD™ CAD-centric philosophy, the award-winning FloTHERM XT product is the industry’s first integrated mechanical design automation (MDA) and electronic design automation (EDA) electronics cooling solution.

This latest version of the FloTHERM XT product offers new functionalities developed from customer feedback to effectively simulate thermal effects of complex geometries.

Key capabilities in this new FloTHERM XT release include simulation of spinning parts in electronic enclosures; temperature-dependent power...

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