August 17, 2016
 

 

 

 

 

Attend Cadence's complimentary two-day workshop to learn how you can do a more thorough job of verifying your SoC designs. Cadence experts will guide you through new protocol developments and demonstrate the application of Verification IP (VIP) to debug these interfaces: PCI Express...

August 15, 2016

Mentor Graphics Corporation today announced the first phase of the new Xpedition printed circuit design (PCB) flow to address the increasing complexity of today's advanced systems designs. The increasing densities of electronics products are forcing companies to develop highly compact system designs with more functionality, and at lower costs. To efficiently manage the density and performance requirements for advanced PCB systems, the new Xpedition flow provides advanced technologies to enable design and verification of 3D rigid-flex structures, and to automate layout of high-speed topologies with advanced constraints.

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August 12, 2016

Kaynes Technology, a leading EMS company based in Mysore, India,  has selected Mentor Graphics to provide a complete design-to-manufacturing solutio,n comprising Mentor Graphics Xpedition Enterprise, HyperLynx, Valor Process Preparation, Valor NPI and Valor Parts Library products. 

“As an end-to-end EMS solutions provider for the medical, defense, telecom, energy,  industrial controls, and IT markets, we need to rely on best-in-class technologies to ensure that our systems are manufactured exactly as intended,” stated Ramesh Kannan, managing director, Kaynes Technology. “Mentor Graphics PCB design and manufacturing products help us reduce lead time, cost and needless duplications for first-pass success.”

Kaynes Technology is replacing its legacy home-grown systems with...

July 28, 2016

Taking a product design from concept to creation can be a complicated process of decisions and tradeoffs. Attention to every detail is required, particularly for the analog, mixed-signal portions of your design.

This webinar will introduce designers to the PADS AMS Design Suite, a complete design capture solution and analog, mixed-signal (AMS) virtual prototyping environment. With this suite, you will be able to create electronic product designs faster and easier while ensuring design intent, performance, and reliability.

What Attendees Will Learn

-  Types of circuit simulation and analysis for behavioral verification, scenario exploration, and component optimization

-  The power and flexibility of VHDL-AMS and SPICE-based simulation and...

July 25, 2016

Mentor Graphics Corporation today announced the latest additions to the PADS PCB Product Creation Platform. New analog/mixed-signal (AMS) and high-speed analysis products address engineering challenges associated with mixed-signal design, DDR implementation, and electrically-correct design signoff. Tightly integrated and highly affordable, the new PADS AMS Design Suite, PADS AMS Cloud, PADS HyperLynx DRC, and PADS HyperLynx DDR products streamline the design process and ensure circuit performance goals are met, reducing the need for prototypes and design re-spins.  Combined with the recently announced PADS HyperLynx® DC Drop and PADS FloTHERM® XT products for power integrity and thermal analysis, the extended PADS Product Creation...

July 6, 2016

Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced today that it has completed the development of the initial version of its software package, which will be integrated in the company's DragonFly 2020 3D printer. The company’s Dragonfly 3D printer, which is currently in development, will use proprietary inks and integrated software to quickly create fully functioning printed circuit board (PCB) prototypes.

The software package, called ‘Switch’, enables preparation of production files of printed electronic circuits using the DragonFly 2020 3D printer. The software supports customary formats in the electronics industry such as Gerber files, as well as VIA and DRILL files.

The ’Switch’ software presents a unique interface that displays Gerber...

July 5, 2016

Zuken's latest version of E3.series—complete solution for electrical and fluid design—offers engineers a live-feel, collaborative environment, along with a range of individual and multi-user usability and productivity features, such as dynamic block functionality and a tabular terminal editor.

The E3.series 2016 has been enhanced to offer a smoother user experience for today’s globally dispersed design teams. Users can work simultaneously on one sheet and instantly see in the sheet tree if another user has opened it, as their user name is visible. And with the latest collaboration technology, including Oracle updates, all objects can now be accessed online. Unique to E3.series, hierarchy is available within a block and offers numerous productivity benefits. Dynamic blocks can...

June 28, 2016

PCBCart, a China-based custom PCB manufacturing, assembly and parts sourcing service provider, recently brought down its PCB prototyping price as a support for independent and small electronics fabricating groups.

The choice to lower prototype prices was to encourage more people to step into electronics fabrication and to benefit existing electronics DIYers with proto boards currently starting from $0.21/pc. If proto customers wish to have PCBCart manufacture and solder their proto boards at the same time, they can enjoy extremely low assembly labor cost as well.

“For us, nothing is more significant...

June 23, 2016

In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released a Matched Delay Optimization feature for the Stackup Planner. 

Signals propagate at the speed-of-light in free space. However, this speed varies dramatically depending on the surrounding dielectric materials. Each layer, of a multilayer PCB, can have a very different propagation speed. This is particularly important for the latest high-speed DDR3/4 memory devices. The new “Matched Delay Optimization” feature, of the ICD Stackup Planner, allows you to not only match the length of busses, but takes this one step further by automatically calculating the appropriate length required to match the delay exactly. The integrated field solver simulates the flight time, of each...

June 22, 2016

IPC Standards Committee Reports, Part 4 — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.

Packaged Electronic Components

The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft of IPC-7091, Design and Assembly Process Implementation of 3-D Components, which will describe design...

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