July 28, 2016

Taking a product design from concept to creation can be a complicated process of decisions and tradeoffs. Attention to every detail is required, particularly for the analog, mixed-signal portions of your design.

This webinar will introduce designers to the PADS AMS Design Suite, a complete design capture solution and analog, mixed-signal (AMS) virtual prototyping environment. With this suite, you will be able to create electronic product designs faster and easier while ensuring design intent, performance, and reliability.

What Attendees Will Learn

-  Types of circuit simulation and analysis for behavioral verification, scenario exploration, and component optimization

-  The power and flexibility of VHDL-AMS and SPICE-based simulation and...

July 25, 2016

Mentor Graphics Corporation today announced the latest additions to the PADS PCB Product Creation Platform. New analog/mixed-signal (AMS) and high-speed analysis products address engineering challenges associated with mixed-signal design, DDR implementation, and electrically-correct design signoff. Tightly integrated and highly affordable, the new PADS AMS Design Suite, PADS AMS Cloud, PADS HyperLynx DRC, and PADS HyperLynx DDR products streamline the design process and ensure circuit performance goals are met, reducing the need for prototypes and design re-spins.  Combined with the recently announced PADS HyperLynx® DC Drop and PADS FloTHERM® XT products for power integrity and thermal analysis, the extended PADS Product Creation...

July 6, 2016

Nano Dimension Ltd., a leader in the field of 3D Printed Electronics, announced today that it has completed the development of the initial version of its software package, which will be integrated in the company's DragonFly 2020 3D printer. The company’s Dragonfly 3D printer, which is currently in development, will use proprietary inks and integrated software to quickly create fully functioning printed circuit board (PCB) prototypes.

The software package, called ‘Switch’, enables preparation of production files of printed electronic circuits using the DragonFly 2020 3D printer. The software supports customary formats in the electronics industry such as Gerber files, as well as VIA and DRILL files.

The ’Switch’ software presents a unique interface that displays Gerber...

July 5, 2016

Zuken's latest version of E3.series—complete solution for electrical and fluid design—offers engineers a live-feel, collaborative environment, along with a range of individual and multi-user usability and productivity features, such as dynamic block functionality and a tabular terminal editor.

The E3.series 2016 has been enhanced to offer a smoother user experience for today’s globally dispersed design teams. Users can work simultaneously on one sheet and instantly see in the sheet tree if another user has opened it, as their user name is visible. And with the latest collaboration technology, including Oracle updates, all objects can now be accessed online. Unique to E3.series, hierarchy is available within a block and offers numerous productivity benefits. Dynamic blocks can be...

June 28, 2016

PCBCart, a China-based custom PCB manufacturing, assembly and parts sourcing service provider, recently brought down its PCB prototyping price as a support for independent and small electronics fabricating groups.

The choice to lower prototype prices was to encourage more people to step into electronics fabrication and to benefit existing electronics DIYers with proto boards currently...

June 23, 2016

In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released a Matched Delay Optimization feature for the Stackup Planner. 

Signals propagate at the speed-of-light in free space. However, this speed varies dramatically depending on the surrounding dielectric materials. Each layer, of a multilayer PCB, can have a very different propagation speed. This is particularly important for the latest high-speed DDR3/4 memory devices. The new “Matched Delay Optimization” feature, of the ICD Stackup Planner, allows you to not only match the length of busses, but takes this one step further by automatically calculating the appropriate length required to match the delay exactly. The integrated field solver simulates the flight time, of each...

June 22, 2016

IPC Standards Committee Reports, Part 4 — Packaged Electronic Components, Rigid Printed Boards, Embedded Devices, Printed Electronics, IP

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the fourth and final in the series of reports.

Packaged Electronic Components

The B-11 3-D Electronic Packages Subcommittee is making significant progress on the work draft of IPC-7091, Design and Assembly Process Implementation of 3-D Components, which will describe design and...

June 2, 2016

These standards committee reports from IPC APEX EXPO 2016 have been compiled to help keep you up to date on IPC standards committee activities. This is the first in a series of reports.

Printed Board Design

The 1-10c Test Coupon and Artwork Generation Task Group announced the release of the IPC-2221B Gerber Coupon Generator. The Generator allows for the creation of Gerber files for AB/R and D test coupon designs found in Appendix A of IPC-2221BGeneric Standard on Printed Board Design, for plated hole integrity and registration evaluations.

The 1-13 Land Pattern Subcommittee met to discuss updates to the IPC-7351C Land and Pad Pattern (Surface mount & through hole) Development Issues and...

June 1, 2016

Douglas G. Brooks, PhD and Dr. Johannes Adam, CID have teamed up to write PCB Trace and Via Currents and Temperatures: The Complete Analysis. Brooks has been looking at trace current and temperature relationships since the mid-1990s. Now, he and Adam, of the consulting group Adam Research, have assembled decades of knowledge into these pages.

Starting with a historical background, this book covers: (a) PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces; (b) The IPC curves found in IPC 2152; (c) Equations that fit those curves; (d) Computer simulations that fit those curves and equations; (e) Sensitivity analyses showing what happens when we vary the environment (adjacent traces and planes, changing trace lengths, thermal...

May 27, 2016

EMA Design Automation, a full-service provider of Electronic Design Automation (EDA) solutions, has launched a ‘Can You Spot the Difference’ Contest for Electrical Engineers.The contest highlights the design compare function added in the new OrCAD 17.2 2016 release which helps users quickly identify what changes are made between PCB design revisions.

“We are excited about the release of the new capabilities for OrCAD. This new graphical compare function is a powerful tool addressing the specialized needs of our users,” said Manny Marcano, President of EMA Design Automation. “Engineers can quickly and easily identify both graphical and electrical differences between two schematics on a page-by-page basis.”

The contest begins on Tuesday, May 24, 2016 and will continue until...

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